| Customization: | Available |
|---|---|
| After-sales Service: | Technical Support |
| Condition: | New |
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Features
The multifunctional NPM-W2 is equipped with a 16-nozzle head and can place 42,000 components. 120 feeders can be mounted.
Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.
As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.
Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market.
This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.
In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used.
| PCB dimensions (mm) | Single-lane |
| Batch mounting | |
| 2-position mounting | |
| Dual-lane | |
| Dual transfer (Batch) | |
| Dual transfer (2-position) | |
| Single transfer (Batch) | |
| Single transfer (2-position) | |
| Placement Head max Speed | 42 000cph (0.094 s/ chip) |
| Placement Head Placement Accuracy (Cpk>=1) |
±40 μm / chip |
| Placement Head Component Dimensions (mm) |
0402 chip ~ L 6 x W 6 x T 3 |
| Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Max.120 (Tape: 4, 8 mm) |
| Dispensing Head | Dispensing speed: |
| Dot dispensing: 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) | |
| Draw dispensing: 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing) | |
| Adhesive position accuracy (Cpk≥1) | |
| Dot Dispensing: ± 75 μ m /dot | |
| Draw Dispensing: ± 100 μ m /component | |
| Applicable components | |
| Dot Dispensing: 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | |
| Draw Dispensing: BGA, CSP | |
| Resolution | 2D inspection head (A) |
| 18 µm | |
| View Size (mm) | 44.4 x 37.2 |
| Inspection Processing Time | Solder Inspection 0.35s/ View size |
| Component Inspection 0.5s/ View size | |
| Inspection Object | Solder Inspection |
| Chip component: 100 μm × 150 μm or more (0603 or more) | |
| Package component: φ150 μm or more | |
| Component Inspection: | |
| Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum | |
| electrolysis capacitor, Volume, Trimmer, Coil, ConnectorInspection Items | |
| Solder Inspection: Oozing, blur, misalignment, abnormal shape, bridging |
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| Component Inspection: Missing, shift, flipping, polarity, foreign object inspection |
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| Inspection Position Accuracy | ± 20 μm |
| No of Inspection | Solder Inspection : Max. 30 000 pcs./machine (No. of components: Max. 10 000 pcs./machine) |
| Component Inspection: Max. 10 000 pcs./machine |
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Why Choose Us?
| Established in 2009, Shenzhen Wenzhan Technology Co., Ltd. has been committed to creating an efficient communication platform to better serve our customers. Our team consists of professional engineers with certifications from the original equipment manufacturers for over a decade. We are dedicated to prioritizing our customers' interests and providing top-quality equipment, accessories, and consumables, as well as technical support. To further reduce our customers' costs, we have established our own machining plant, ensuring ample inventory and competitive pricing. | 1. Professional pre-sales advice support 2. Excellent after-sales technical service 3. Flexible payment and return policy 4. One-stop solution for SMT Line 5. Sufficient stock and fast deliver |
FAQ
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