| Customization: | Available |
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| Metal Coating: | Tin |
| Mode of Production: | SMT |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
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The 2D-AOI is a high-speed, high-precision 2D visual inspection device that supports multiple inspection processes, such as SMT, and through-hole processes. The extremely durable hardware design guarantees a more stable inspection quality than traditional visual inspection and contributes to significant labor savings at production sites.
01 High-speed Inspection System
Simultaneous full-board imaging for high-speed inspection
Saki's unique Line Scanning Technology
High-speed inspection is achieved through the simultaneous imaging of the entire PCB, utilizing Saki's unique line scanning technology. Images of the entire board are rapidly acquired through batch imaging using a line sensor camera - takt time is unaffected by either the number of parts or mounting status.
02 High Reliability
Robust hardware design guarantees high inspection quality for an extended lifetime
Unique lighting technology to obtain shadow-free images
Inspection reliability is improved with hardware specifically designed for high-speed, high-precision imaging, that utilizes Saki's unique lighting technology for shadow-free image capture.
The stable, uniaxial hardware design ensures low vibration and high durability, while a compact housing design contributes to improved area productivity.
A coaxial top light illuminates from directly above each inspected component at all positions on the board, capturing angular objects, such as solder surfaces, without being affected by adjacent components.
03 Multiple Inspections
Simultaneous double-sided inspection to increase production efficiency
Solder inspection of inserted components
Extra Component Detection (ECD) detects fallen parts, foreign objects, and solder balls across the entire board
The 2D-AOI inspects both the mounting surface and soldering surface of through-hole components at the same time.
Since no reversing machine is required, damage to the board from reversing is prevented, equipment investment efficiency is improved, and area productivity increased by shortening line length.
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Model |
BF-Comet18 |
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Installation type |
Benchtop |
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Size (W) × (D) × (H)mm (in.) |
580 × 850 x 452 (22.8 x 33.5 x 17.8) |
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Resolution |
18um |
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PCB Clearance |
Top: 40mm (1.57 in.) Bottom: 60mm 2.36 in.) |
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Electric Power Requirement |
Single-phase ~ 100-120/200-240V +/-10%, 50/60Hz |
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PCB Size (W) × (L)mm (in.) |
50 × 50 - 250 x 330 (2 × 2 - 10 × 13) |
Why Choose Us?
| Established in 2009, Shenzhen Wenzhan Technology Co., Ltd. has been committed to creating an efficient communication platform to better serve our customers. Our team consists of professional engineers with certifications from the original equipment manufacturers for over a decade. We are dedicated to prioritizing our customers' interests and providing top-quality equipment, accessories, and consumables, as well as technical support. To further reduce our customers' costs, we have established our own machining plant, ensuring ample inventory and competitive pricing. | 1. Professional pre-sales advice support 2. Excellent after-sales technical service 3. Flexible payment and return policy 4. One-stop solution for SMT Line 5. Sufficient stock and fast deliver |
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